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WLCSP LED Superiority 3
http://www.fullsunled.com/en/custom_20562.html DOB(COB) with a Wire bonding COB comparison table DOB(COB) with a Wire bonding COB comparison table ※免封裝DOB(COB) 與 焊線式COB 優缺點比較 免封裝DOB(COB)--馥珅光電焊線式COB1.組裝防呆無壓斷金線風險有壓斷金線風險2.結構簡單傳統且穩定的錫膏固晶製程約90%不良為金線剝落或斷裂3.極低熱阻以高導熱錫膏做導熱唯一路徑導熱須經導熱差的藍寶石與固晶膠材4.極低Tj同規格DOB(COB),免封裝於350mA電流僅176℃同規格COB,焊線式於240mA電流達192℃5.極小溫差同規格DOB(COB),免封裝因Tj與Tp溫差小,容許最高板溫可達95℃同規格COB,焊線式因Tj與Tp溫差大,容許最高板溫可達85℃6.獨立失效單顆LED失效時,不會使相鄰LED跟進失效單顆LED失效時,會使其同串聯LED跟進失效7.高載電流同規格DOB(COB),免封裝於680mA達飽和同規格COB,焊線式於480mA即達飽和8.高壽命一倍~三倍電流皆無光衰或死燈不良情形二倍電流僅剩77%光束維持率,350ma電流死燈 
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