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※馥珅光電接受訂製規格生產,請撥04-2358-3333 將有專人為您服務,謝謝。馥珅是業界原創免封裝LED (WLCSP LED)、覆晶LED、倒裝LED、Flip chip 專業技術研發團隊並唯一持有專利者。秉持不斷精進產品特性、創造產品創新優勢,追求高品質的我們,產品更值得推薦給您。We accept to customize production specifications, please call +886 4 2358 3333. thank you. Full Sun is an original professional team for Flip chip, also the only company has patent. Full Sun provides total solution of LED makers including Flip chip, wlcsp (wafer level chip scale packaging ) , COB and components for LED packaging.
  • 13x13 36V【5W-12W】

    Flip chip technology of FULL SUN company. 1) No gold boning wire. 2) Solder paste is the only conductivity track. 3) When single LED fails, this won't affect the near LED.


  • 19x19 36V 【9W-36W】

    Flip chip technology of FULL SUN company. 1) No gold boning wire. 2) Solder paste is the only conductivity track. 3) When single LED fails, this won't affect the near LED.


  • 28x28 36V 【22W-90W】

    Flip chip technology of FULL SUN company. 1) No gold boning wire. 2) Solder paste is the only conductivity track. 3) When single LED fails, this won't affect the near LED.


  • 42x38 33V 【22W-240W】

    Flip chip technology of FULL SUN company. 1) No gold boning wire. 2) Solder paste is the only conductivity track. 3) When single LED fails, this won't affect the near LED.


  • 42x38 45V 【22W-240W】

    Flip chip technology of FULL SUN company. 1) No gold boning wire. 2) Solder paste is the only conductivity track. 3) When single LED fails, this won't affect the near LED.


  • 63x57 45V 【55W-470W】

    Flip chip technology of FULL SUN company. 1) No gold boning wire. 2) Solder paste is the only conductivity track. 3) When single LED fails, this won't affect the near LED.


  • 110x110 45V 【150W-1000W】

    Flip chip technology of FULL SUN company. 1) No gold boning wire. 2) Solder paste is the only conductivity track. 3) When single LED fails, this won't affect the near LED.



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